发明名称
摘要 <p>A wafer holder 24 suitable for handling wafers of any of selected different diameters at a time in vapor-drying wafers and an apparatus for vapor-drying wafers 2 using the wafer holder 24 is presented. The wafer holder 24 is secured onto the fore end of the robot arm for drying 16 and has a plurality of wafer holding means in united one body each of which is capable of holding one or more wafers of one of selected different diameters and which is interchangeable with another wafer holding means by rotating the wafer holding means united in one body in accordance with selection of wafers of another diameter to be vapor-dried. <IMAGE></p>
申请公布号 JP2894535(B2) 申请公布日期 1999.05.24
申请号 JP19940003354 申请日期 1994.01.18
申请人 SHINETSU HANDOTAI KK 发明人 UCHAMA ISAO;KUDO HIDEO
分类号 B65G49/07;H01L21/00;H01L21/304;H01L21/67;H01L21/683;(IPC1-7):H01L21/304;H01L21/68 主分类号 B65G49/07
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