| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board, wherein a wiring top can be ensured of enough width without deteriorating the surface of a copper foil in adhesion to a solder resist. SOLUTION: A prepreg 2 and an outer copper foil 3 are laminated on both the sides of an inner board 1 where an inner circuit is provided and thermocompressed into one piece, a through-hole 4 is provided in the laminate so as to electrically connect the inner circuit to the outer copper foil, a thermosetting resin layer on the inner wall of the through-hole 4 is roughened, the inner wall of the through-hole and the surface of the outer copper foil are plated, the surface of the outer copper foil is turned smooth by mechanical polishing, and plating resists 5 are formed. The laminate is dipped into an acidic solution making air blow into the solution and subjected to solder plating 6, the plating resists 5 are removed, a part of the board 1 which is not plated with solder is selectively removed by etching with alkali etchant, the solder plating is removed, solder resists 8 are printed and cured, and then an Ni/Au plating 9 is formed. |
