| 摘要 |
PROBLEM TO BE SOLVED: To reduce the warp due to shrinkage of a prepreg by providing a prepreg impeded from shrinking during heat pressure molding. SOLUTION: Two printed boards 1 are adhered such that a prepreg 2 is set between the boards 1, they are positioned and laminated, without deviation thereof, using laminating outputting reference pins 3, fixed to a laminate die 4, molded with hot plates 5 by the heat pressure molding to form a multilayer printed wiring board. Such printed wiring board impedes the prepreg 2 from shrinking to reduce resulting warp. This facilitates inserting/drawing connectors, etc., to/from the wiring board and lessens the trouble at automated process steps for mounting components. |
