| 摘要 |
PROBLEM TO BE SOLVED: To provide the thermocompression bonding device and method of electronic components for easily setting a control target value in a thermocompression bonding process and confirming and changing the setting details. SOLUTION: In the thermocompression bonding device of electronic components for thermocompression bonding electronic parts by heating the electronic components being retained by a thermocompression bonding tool using a heater, raising and lowering the thermocompression bonding tool and pressing the electronic components to a substrate, control target values that are set for each step of thermocompression bonding process being divided into a plurality of steps, namely target time 33 of the steps, a heating target temperature 34 of the heater, and the control target values (a target height 34 and a target load 35) of a raising and lowering means, are simultaneously displayed in a table format on the same screen 30 of a display part and the control target values are set and inputted on the screen, thus visually grasping the mutual relationship of the control target values and easily confirming and changing the setting operation and details of the control target values. |
