| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer circuit board which can be stably bonded to a mother board even if the inner wall of a through-hole where a terminal electrode is formed becomes rugged owing to that green sheets deviate from each other in lamination. SOLUTION: Internal wirings 11 are arranged between insulating layers 1a to 1d comprised in a laminate 1, a surface wiring is arranged on the main surface of the laminate 1, and terminal electrode 3 is formed in a recess 30 which is provided in the edge face of the laminate 1 extending in the thickness direction of the laminate 1 for the formation of a multilayer circuit board, wherein the terminal electrode 3 provided on the inner surface of the recess 30 of the laminate 1 is formed on a base insulating film 5 deposited on the inner wall surface of the recess 30 and connected to the surface wiring 2 on the primary surface of the laminate 1.</p> |
