| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having pad structure for protecting a bonding neck especially from the shift of resin in a vertical direction owing to thermal stress and the expansion of resin and preventing the neck from being cut. SOLUTION: A conductor layer of a bonding pad is made into two layers. A through hole which passes through the center part of the bonding pad 1 in a second layer and through which the surface of the bonding pad of the first layer is exposed is provided. The hole is connected to both pads 1 and 2. Projecting and recessed arts engaged with the lower face of the bonding hole 3 are provided at the peripheral part of the surface of the bonding pad 2 in the second layer. The contact area of the bonding pad in the second layer is made to be larger than the contact area of the bonding pad 2 in the first layer. Then, stress on a bonding wire at the time of sealing resin is reduced with the pad structure of the two layers different in bonding strength. |
