| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device realizing long wire bonding and to provide the manufacture method. SOLUTION: Lower polyimide tapes (lower insulating films) 4 provided on a mounting chip, bonding wires 6 extending on the lower polyimide tapes 4 and upper polyimide tapes (upper insulating films) 7 covering the bonding wires 6 are provided. Namely, the bonding wires 6 are sandwiched by the lower polyimide tapes 4 provided on the mounting chip and the upper polyimide tapes 7. |
