| 摘要 |
<p>PROBLEM TO BE SOLVED: To lessen damage to products when defective products are punched and eliminate the need of a cover tape by raising part of an insulation film at least between products of a film carrier tape over the height of a semiconductor chip to form corrugations. SOLUTION: Corrugations 2 are formed by the thermoplastic molding, etc., for forming an insulation film 1a such that this film 1a is drawn over its entire width like a semicircular-sectional corrugation higher than the height of a semiconductor chip 3 of a product 5, provided that the height of the corrugation 2 must be still higher than the chip 3 after the chip is molded. The corrugation 2 has one sprocket tooth-insertable hole at each side of the film carrier tape, instead of a sprocket hole 6. To avoid the pitch deviation, that hole is punched after forming the corrugation 2.</p> |
