| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a semiconductor device that can be manufactured inexpensively and have simple structure, and its manufacturing method. SOLUTION: In a method for manufacturing a substrate A for a semiconductor device, where a plurality of circuit boards 10-12 in that a lead frame 25 and insulation layers 14, 17, and 18 are laminated are laminated still further, the lead frame 25 manufactured in advance is arranged into molds 26 and 27, a sealing resin is poured, and resin is sealed so that the specific part of the lead frame 25 is exposed on the surface of the encapsulating resin, thus manufacturing the circuit substrates 10-12. |
