| 摘要 |
PROBLEM TO BE SOLVED: To realize further thinning and to obtain high reliability by precisely mounting optical parts such as light receiving/emitting elements and a hologram element, etc., in the same package. SOLUTION: The integrated optical element 11 is provided with first, section photodetectors 15, 16 arranged on a silicon substrate 13, a light emitting element 18 arranged on the silicon substrate 13 through a light outputting substrate 17 and the hologram element 23 arranged on the silicon substrate 13 opposite to the light emitting element 18, diffracting return light from an optical recording medium and leading it to respective first, second photodetectors 15, 16. Relating to this integrated optical element 11, a light beam outgoing from the light emitting element 18 is emitted onto the signal recording surface of the optical recording medium after it transmits linearly through from the light emitting element 18 to the hologram element 23. |
