| 摘要 |
PROBLEM TO BE SOLVED: To provide an aluminum nitride wiring board, and a production method thereof, in which an insulating basic body, i.e., a metallize layer of a metallize composition, which can be sintered simultaneously with aluminum nitride(AIN) ceramic superior in heat dissipation is integrated as a low resistance wiring conductor satisfying electrical requirements. SOLUTION: Main components of copper(Cu) and tungsten(W) or molybdenum(Mo) are added externally with an active metal of nickel(Ni) and/or titanium(Ti) to produce a metallized composition which is then sintered simultaneously with aluminum nitride(AIN) ceramic to obtain a low resistance metallize layer which is employed as a wiring conductor of an aluminum nitride wiring board. The aluminum nitride(AIN) ceramic and the metallize composition are sintered simultaneously at 1,550-1,900 deg.C to form a low resistance wiring conductor. |
