| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device in which a uniform plating is performed, and moreover if the species and sizes of semiconductor wafers which are performed-plating are changed, the plating is performed while adjusted without replacing an anode plate. SOLUTION: In a jetting semiconductor manufacturing device, a semiconductor wafer W is supported by a cathode pin above a treatment bath opened upward with its treated surface being faced down, and also an anode plate 3 is arranged within the treatment bath and a treatment fluid is jetted on the treated surface of the semiconductor wafer W, while a current flows between the semiconductor wafer W and the anode plate 3 so that the semiconductor wafer W is performed plating, formation or the like. In this embodiment, the anode plate 3 is constituted by a plurality of unit anode plates and also an electric wire is made in respective unit anode plates, and a conductive time and a conductive amount on the respective unit anode plates are adjusted, while a treatment such as plating, formation or the like is performed. |
