发明名称 BALL GRID ARRAY SEMICONDUCTOR PACKAGE
摘要 PROBLEM TO BE SOLVED: To ensure a sufficient area for connecting leads and make many leads usable by providing at least a lead fixed at one end to a semiconductor chip with the other bent at specified angle and horizontally extending leads. SOLUTION: Leads 53-56, 53'-56' are fixed at their ends to the bottom of a semiconductor chip 65. At least one of the leads 53-56, 53'-56', is bent at specified angle from its length, pref. vertically after extending horizontally from the bottom of the chip 65 and the bent leads 54, 56, 54', 56' and non-bent leads 53, 55, 53' 55' are pref. alternately disposed. Bumps 71-74, 71'-74' are fixed to the leads 53-56, 53'-56'.
申请公布号 JPH11135571(A) 申请公布日期 1999.05.21
申请号 JP19980241681 申请日期 1998.08.27
申请人 SAMSUNG AEROSPACE IND LTD 发明人 KIN EISHUN
分类号 H01L23/28;H01L21/60;H01L23/12;H01L23/48;H01L23/495;H01L23/50 主分类号 H01L23/28
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