摘要 |
PROBLEM TO BE SOLVED: To ensure a sufficient area for connecting leads and make many leads usable by providing at least a lead fixed at one end to a semiconductor chip with the other bent at specified angle and horizontally extending leads. SOLUTION: Leads 53-56, 53'-56' are fixed at their ends to the bottom of a semiconductor chip 65. At least one of the leads 53-56, 53'-56', is bent at specified angle from its length, pref. vertically after extending horizontally from the bottom of the chip 65 and the bent leads 54, 56, 54', 56' and non-bent leads 53, 55, 53' 55' are pref. alternately disposed. Bumps 71-74, 71'-74' are fixed to the leads 53-56, 53'-56'. |