| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board which is excellent in bonding properties to a glass-ceramic material and kept free from warpage and where cracks are restrained from occurring around via hole conductors. SOLUTION: Internal wirings 3 of Ag conductor are arranged between insulating layers 1a to 1d formed of glass-ceramic material which can be burned at temperatures of 800 to 1000 deg.C for the formation of a laminate main body 1, surface wirings 2 are formed on the surface of the laminate main body 1, and via-hole conductors 4 are formed to connect the internal wirings 3 together or the internal wirings 3 to the surface wirings 2 penetrating through the insulating layers 1a to 1d. The internal wirings 3 and the via-hole conductors 4 are formed of metal material of Ag or Ag alloy loaded with at least V2 O5 and quartz. |
