| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module, the characteristics of which can be easily inspected in the single substance of a semiconductor element and where a plurality of semiconductor packages whose reliability is guaranteed are mounted dense. SOLUTION: Two kinds of semiconductor elements 1a and 1b are connected to wiring patterns 3a and 3b on substrates 2a and 2b by bumps 4a and 4b, semiconductor packages 6a and 6b which are sealed by a sealing resin 5 for forming are laminated and arranged on a substrate 8 for packaging by an adhesive 9, the wiring pattern 3a connected to the semiconductor element 1a that is pulled towards the outside of the sealing resin 5, the wiring pattern 3b which is connected to the semiconductor 1b, and an electrode on the substrate 8 for packaging are electrically connected by a wire 7.
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