发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacture which realizes contacts and satisfactorily electrical connections with wiring or electrodes to electrically connect to the contact, even when the effects of deviation of laminating is increased by refining an element. SOLUTION: Sidewalls 5a to 5d consisting of conductive matters are stick- formed on the side surfaces of wirings 4a and 4b preferably trying to arrange on contacts 3a and 3b to obtain an electrically satisfactory connecting state via the sidewalls 5a to 5d, even when deviations in laminating is generated. In addition, the wirings 4a, 4b and the sidewalls 5a to 5d are made a storage node, a dielectric films and a cell plate are laminated to obtain a capacitor and as the upper part of the storage node is made into a rounded state by forming the sidewalls, the concentrating of electric fields is suppressed in this structure.
申请公布号 JPH11135746(A) 申请公布日期 1999.05.21
申请号 JP19970297230 申请日期 1997.10.29
申请人 MITSUBISHI ELECTRIC CORP 发明人 TOMITA KAZURO
分类号 H01L21/768;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108 主分类号 H01L21/768
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