| 摘要 |
PROBLEM TO BE SOLVED: To provide an easy-to-handle semiconductor package. SOLUTION: This semiconductor package comprises a mounting board 10 having a size equal to or slightly larger than that of a semiconductor chip, a plurality of bumps 31 for chip formed by plating on the basic material 11 side of the board 10 and connected with the electrode of the semiconductor chip, and a plurality of bumps 32 for external connection formed by plating on a copper foil conductor 12 side of a motherboard and connected externally with the mother board, or the like. The bump 31 for chip and the bump 32 for external connection are connected, in one to one correspondence, through a patterned conductor 12. Furthermore, an insulation layer 20 of solder resist, or the like, is formed on the side of the board 10 where the conductor 12 is provided. |
