| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC card capable of surely and stably adhering a cover sheet with a card main body while avoiding an air layer to be formed between the cover sheet and an IC module when the cover sheet is adhered with the card main body. SOLUTION: This method is for manufacturing the IC card to store the IC module 1 in a storage opening 2a of the card main body 2 and to coat both front and rear surfaces of the card main body 2 with the cover sheets 3, 4 when the storage opening 2a is blocked, a very small projection 1e is formed at upper and lower surfaces of the IC module 1 to be placed on an opening surface of the storage opening 2a and the cover sheet 3 is adhered with the card main body 2 while piercing the cover sheet 3 by the very small projection 11e when the cover sheet 3 at a front side of the card main body 2 is adhered with the card main body 2. |
