发明名称 Chuckar och förfaranden för att placera flera objekt på ett substrat
摘要 <p>The chuck (180) comprises an upper chuck face (110), which may be glass of 10-20 mm thick, and has through holes or passages (120) of diameters between approx. 50 mu m and approx. 75 mu m connected to a cavity (130) in a base (140). The base has an opening (150) for connection to a vacuum source (160), which imparts a negative pressure to the passages in the chuck face. - Beads (170) having an average diameter less than approx. 3 mm poured onto the chuck face are held by the negative pressure, through the application of a vacuum, onto a selected configuration of through holes. The beads may alternatively be attracted electrostatically to the chuck.</p>
申请公布号 FI991163(A0) 申请公布日期 1999.05.21
申请号 FI19990001163 申请日期 1999.05.21
申请人 SARNOFF CORPORATION 发明人 SUN, HOI CHEONG STEAVE;KNOEDLER, CHRISTINA MARIE
分类号 A61K9/20;B01J19/00;B05B5/08;B23B;B23B5/22;(IPC1-7):G01N 主分类号 A61K9/20
代理机构 代理人
主权项
地址