| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a buffer sheet for semiconductor wafers with improved cushion property by forming a projecting part on both surfaces of a dipping paper with an organic binder and a filler constituent of a specific pts.wt with respect to a pulp pts.wt. SOLUTION: A filtering dust-generating paper consisting of 100 pts.wt pulp, 5-40 pts.wt binder, and 0-3 pts.wt filler is used for a dipping paper. The pulp is subjected to a normal paper machine to produce a stencil paper, emulsion of a water-based or solvent-based binder, a water solution, an organic solvent solution, or a suspension is dipped into the stencil paper, the stencil paper is heated and dried at 100 deg.C-150 deg.C for approximately 5 seconds-5 minutes as needed, and pulp fibers are combined mutually. Then, projecting parts 3 and 4 are formed on both surfaces of the dipping paper. The projecting parts 3 and 4 may be provided by emboss machining but may also be cured by having light irradiated after a projecting pattern has been applied, or a photo setting composition may be applied to both surfaces in a pattern shape so that it forms projecting shape. The total area of the projecting parts 3 and 4 is required to be 3-40% per side.</p> |
