| 摘要 |
<p>PROBLEM TO BE SOLVED: To miniaturize a circuit board, perform high-density packaging, and provide a semiconductor integrated device with improved heat radiating. SOLUTION: A circuit pattern 9 and a recessed part 7 are formed on a board 1, and a circuit terminal 4 is provided at the bottom of the recessed part 7. A semiconductor pair chip 2 is electrically connected to a circuit terminal 4 in the recessed part 7 via a bump 3 formed on an electrode on the circuit surface of the semiconductor pair chip 2. Electrically insulated resin 5 where a filler 6 is mixed is filled into the recessed part 7, and the entire semiconductor pair chip 2 packaged into the recessed part 7 is sealed by the resin 5.</p> |
