| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the occurrence of shorting of the bonding pads, etc., exposed on a chip surface by providing the circumferences of input/output electrodes with electrically floating dummy electrodes arranged so as to attain the same polishing rate as the polishing rate of pixel electrodes. SOLUTION: The bonding pads 11 and the electrically floating dummy electrodes 12 are formed by planarizing the surface by using chemical mechanical polishing(CMP) and simultaneously removing AL on P-SiO 7. The electrically floating dummy electrodes 12 are arranged overall around the bonding pads 11 in such a manner and the shapes and sizes of the dummy electrodes 12, the distances between the dummy electrodes 12 and the positional relations between the adjacent dummy electrodes 12 are made the same as those of the pixel electrodes of an image display section. As a result, the parts remaining without being polished on the peripheries of the bonding pad parts may be prevented and the occurrence of the shorting between the bonding pad parts may be prevented.</p> |
