| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor acceleration sensor for inspecting characteristics in the state that no gravity is applied to a weight, and a method for inspecting it. SOLUTION: A method for manufacturing a semiconductor acceleration sensor comprises the steps of forming a strain detector 2 on a front surface side of a semiconductor substrate 1, forming a thin film 3 on a rear surface side of the substrate 1 by etching, forming an electrode 4, a wiring 5 and the like on the front surface side of the substrate, then forming a weight 8 by forming an air gap 7 so that a part of the film 3 is retained as a beam 11, inspecting characteristics of the sensor in the state that a lower surface of the weight 8 is brought into contact with a front surface of a pedestal 6 having no protrusion and recess part on its front surface at the stage of connecting the pedestal 6 to the rear surface side of the substrate 1, then coating the front surface side of the substrate with a resist 12, forming a recess 13 at the pedestal 6 connected to the rear surface side of the substrate 1 by etching, removing the resist 12, and then connecting a pedestal 9 to the front surface side of the substrate 1.</p> |
