| 摘要 |
PROBLEM TO BE SOLVED: To provide technology capable of well protecting an IC chip and a substrate on which the IC chip is mounted. SOLUTION: In a method for manufacturing of an IC module on which the IC chips 3 are mounted so as to be conducted with a conductive pattern on a substrate and the IC chips are sealed with resin, a process to mount the IC chips 3 so as to be conducted with the conductive pattern on an insulated tape 2A like a long-length belt on which plural conductive patterns are formed so as to be arranged in a longitudinal direction and a process to use upper and lower molds 5A, 5B to form a cavity space 50 at a state of mold clamping, to simultaneously store the IC chips 3 and the conductive patterns inside the cavity space 50 so as to be positioned at an approximately intermediate position in the up and down directions of the cavity space 50 and to seal the conductive patterns and the IC chips by injecting fused resin inside the cavity space 50 are included and a tape on which piercing holes 25, 26 are formed so as to evade an area on which the IC chips 3 are mounted is used as the insulated tape 2A in every area on which respective conductive patterns 20 are formed. |
