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发明名称
Goldlösung für stromloses Plattieren
摘要
申请公布号
DE69506344(T2)
申请公布日期
1999.05.20
申请号
DE19956006344T
申请日期
1995.08.14
申请人
ELECTROPLATING ENGINEERS OF JAPAN, LTD., TOKIO/TOKYO, JP
发明人
WACHI, HIROSHI, KOZA-GUN, KANAGAWA-KEN, JP;OTANI, YUTAKA, KANAGAWA-KEN, JP
分类号
C23C18/44;(IPC1-7):C23C18/44;C23C18/42
主分类号
C23C18/44
代理机构
代理人
主权项
地址
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