Circuit board with low-inductance connection of solder pad to conductive track

摘要

The circuit board (12) has at least one solder pad (1) on one surface and a through-contact to at least one conductive track on another surface of the board or within the board. A lead (2) connects the solder pad to the through-contact. The through-contact consists of at least two parallel-connected metallised holes (3). The lead between the solder pad and the hole nearest the pad has at least the same width as the solder pad.