Process for encapsulating an electronic component and electronic component thus encapsulated

摘要

Process for encapsulating an electronic component, in particular an integrated circuit, with an encapsulating material, at least comprising the steps of: placing the component to be encapsulated in a cavity of a mould; introducing the encapsulating material at elevated temperature into the cavity between the mould and the component to be encapsulated; hardening the encapsulating material; and releasing the encapsulated component from the cavity, the encapsulating material used comprising 40-65 % by weight of the engineering thermoplast and 60-35 % by weight of the reactive solvent.