| 摘要 |
An active pixel sensor comprising: a substrate of a first conductivity type having a surface containing PMOS and NMOS implants that are indicative of a sub-micron CMOS process; a photodetector formed at a first depth from an implant of a second conductivity type that is opposite the first conductivity type on the surface; a gate on the surface adjacent to the photodetector; and wherein the photodetector is formed by an implant of the second conductivity that is deeper and more lightly doped than implants used within the sub-micron CMOS process. The sensor has the photodetector is formed by an implant angled towards the gate. The preferred embodiment of the sensor further employs a pinning layer formed at a second depth that is less than the first depth from the first conductivity type more near the surface than the photodetector. <IMAGE>
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