发明名称 Magnetic component assembly
摘要 <p>A magnetic component assembly includes a circuit board having at least one layer. A first winding is provided on at least one surface of a layer of the circuit board and a further winding is provided on the same or a different surface of the circuit board. A first magnetic core is associated with the first winding to define a first magnetic component and a further magnetic core is associated with the further winding to define a further magnetic component. There is thereby provided an assembly of two or more magnetic components integrated in a single circuit board providing an efficient space saving configuration. A particular application relates to the provision of integrated magnetic components for power supplies. &lt;IMAGE&gt;</p>
申请公布号 EP0917163(A2) 申请公布日期 1999.05.19
申请号 EP19980308301 申请日期 1998.10.13
申请人 SUN MICROSYSTEMS, INC. 发明人 ROWLEY, ANNA K.;MURTON, ROBERT G.;WALKER, DONALD E.
分类号 H01F27/28;H01F17/00;H01F30/00;H01F37/00;H02M3/28;H05K1/16;H05K3/46;(IPC1-7):H01F27/28 主分类号 H01F27/28
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