| 摘要 |
<p>A new mounting technology allows an optical transducer or semiconductor device to be mounted on a printed wiring board at high density, simply, and at low cost. When a sealed assembly is mounted on a printed wiring board (400), an opening portion (340) is provided in a portion of the printed wiring board. Conductive junction portions (360b and 360c) are provided on the surface of a base member (100). Then, the mounting is carried out by face-down bonding. The opening portion is provided in the printed wiring board, so that at least a portion of a sealing member of the sealed assembly is inserted in the opening portion. Such a structure makes face-down bonding possible, since the thickness of the sealing member of the sealed assembly and the thickness of the printed wiring board are adjusted by inserting the sealed assembly into the printed wiring board. <IMAGE></p> |
