| 摘要 |
<p>In an electrical part, projecting sections (llf) for defining an open section are formed on a bottom face (11a) of a casing (11), so that a height difference is formed between the bottom face of the casing and the projecting sections. Even if the casing is warped and deformed due to air heated to a high temperature during reflow-soldering for surface-mounting the electrical part on a printed circuit board, the deformation of the casing can be absorbed by the height difference, which achieves high-quality soldering. <IMAGE></p> |
