Wafer polishing

摘要

A method of polishing a wafer comprises a plurality of polishing steps giving a progressively finer polished wafer surface. At least one of these steps comprises a first stage in which the wafer is rotated in a first direction while being polished on a first polishing pad and a second stage in which the wafer is rotated in the opposite direction while being polished on a second polishing pad. The second polishing pad also rotates in the opposite direction to the first polishing pad.