| 摘要 |
The connection arrangement includes at least two flat, rectangular connection pins (2) formed as metallic stanced metal sheet pieces, which comprise a section formed as support surface area (3, 4), at both their longitudinal ends. Both support surface areas of each connection pin form a coplanar support surface on a substrate when the hybrid circuit (1) is assembled and soldered. The support surface areas comprise also a mounting section (5) between both their longitudinal ends, which proceeds parallel to the support surface areas. Bent Zn elements (6) are provided, by which the hybrid circuit is fastened vertically to the support surface on the respective support surface area in such way, that sections extending at the sides of the hybrid circuit and the support surface areas form a support base for the connection arrangement when assembling and soldering the circuit. |
