| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMP polishing device to prevent the occurrence of a fluctuation in a polishing rate when CMP polishing of a material layer formed on a semiconductor substrate is executed, prevent the occurrence of scratch to a wafer during polishing, and improve reliability and productivity. SOLUTION: A conditioning disc 6 is brought into contact with a brush 14 and the disc 6 is rotationally driven by a drive part arranged at the support part of an arm 7. This constitution effects slide rubbing of the surface of the disc 6 and forcibly removes polishing chips and polishing pad chips adhered on a surface. Thus, lowering of a protrusion amount of diamond abrasive embedded in the disc 6 is prevented and constantly stable conditioning of the polishing pad is practicable, and stability of a polishing rate is improved. Further, as a result of polishing chip and polishing pad chip being prevented from flaking and falling on a polishing pad, scratches are prevented from occurring to a wafer to be polished due to a foreign matter. |
