发明名称 Resist pattern forming method and resist material
摘要 A polymer having a unit expressed as "-CH2CHR-" as well as a substituent capable of being decomposed by acid is employed as a base resin for a resist material. The resist material is further mixed with an acid generator. A resist pattern obtained by selectively exposing and developing the resist material is irradiated with light having a wavelength of not more than 300 nm under a nitrogen atmosphere. Active hydrogen at the alpha -position of the unit dissociates as a result to form polymer radicals, which are linked with each other in progress of a crosslinking reaction. Namely, a crosslinked structure of the polymer is formed. Consequently, a resist pattern having high dry etching resistance is completed.
申请公布号 US5905016(A) 申请公布日期 1999.05.18
申请号 US19970917604 申请日期 1997.08.26
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KISHIMURA, SHINJI
分类号 G03F7/004;G03F7/039;G03F7/20;G03F7/40;H01L21/027;H01L21/312;(IPC1-7):G03C1/492 主分类号 G03F7/004
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