发明名称 LASER/PUNCH COMPOUND MACHINE
摘要 <p>PROBLEM TO BE SOLVED: To widen a processing range and improve productivity by eliminating offsets of a laser processing region and a punch processing position, and equalizing shaft moving volume and a compound processing range. SOLUTION: A ram 13 punching a punch P is installed turn out freely from right above a punch processing position K, and a notch part 45, which a laser processing head 51 can enter, is arranged at an appropriate position of an upper turret 9 to equalize a laser processing region L being a forward limit of the laser processing head 51 with the punch processing position K. This makes it possible to equalize the laser processing region L and the pouch processing position K, widen the laser processing range, and improve productivity.</p>
申请公布号 JPH11129085(A) 申请公布日期 1999.05.18
申请号 JP19970295805 申请日期 1997.10.28
申请人 AMADA CO LTD 发明人 YOSHIKAWA NOBORU
分类号 B23P23/02;B21D28/36;B23K26/02;B23K26/08;(IPC1-7):B23K26/08 主分类号 B23P23/02
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