发明名称 |
Micromechanical acceleration sensor |
摘要 |
A micromechanical acceleration sensor consists of a first semiconductor wafer and a second semiconductor wafer, where on the first semiconductor wafer first and second electrodes, are provided to create a variable capacitance and the second semiconductor wafer has a movable third electrode, and where on the first semiconductor wafer there is a microelectronic evaluation unit. The moveable electrode is a rocker suspended asymmetrically with regard to an axis of rotation such that each respective portion is of a different length and is opposite one of the first and second electrodes. A closed ring structure is disposed on the surface of the first semiconductor wafer.
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申请公布号 |
US5905203(A) |
申请公布日期 |
1999.05.18 |
申请号 |
US19960723545 |
申请日期 |
1996.09.30 |
申请人 |
TEMIC TELEFUNKEN MICROELECTRONIC GMBH |
发明人 |
FLACH, GEORG;NOTHELFER, UDO;SCHUSTER, GUENTHER;WEBER, HERIBERT |
分类号 |
G01P15/08;G01P15/125;H01L29/84;(IPC1-7):G01P15/125 |
主分类号 |
G01P15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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