发明名称 Capacitor structures, DRAM cell structures, methods of forming capacitors, methods of forming DRAM cells, and integrated circuits incorporating capacitor structures and DRAM cell structures
摘要 The invention includes a construction comprising: a) an opening extending through an insulative layer to a node location; b) a conductive spacer within the opening and narrowing at least a portion of the opening; the conductive spacer having inner and outer surfaces; c) a storage node layer in connecting with the node location and extending along both of the inner and outer surfaces of the conductive spacer, the storage node layer and conductive spacer together forming a capacitor storage node; and d) a dielectric layer and a cell plate layer operatively proximate the storage node.
申请公布号 US5905280(A) 申请公布日期 1999.05.18
申请号 US19970798241 申请日期 1997.02.11
申请人 MICRON TECHNOLOGY, INC. 发明人 LIU, YAUH-CHING;KAO, DAVID Y.
分类号 H01L21/02;H01L21/768;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L21/02
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