发明名称 METHOD AND APPARATUS FOR MOLDING RESIN COATING
摘要 PROBLEM TO BE SOLVED: To facilitate the automation of molding and the molding of a molding with depth. SOLUTION: A molding recession 2 and a ring-shaped sealing recession 3 are formed in a lower mold 1, the recession 2 and the recession 3 are made to communicate with each other by a communication passage 4, and a pot 5 for a coating material is formed between the recession 2 and the recession 3. After a molding material for a base is supplied to the recession 2, the molding projection 8 of an upper mold 7 is engaged with the molding recession 2 by mold clamping so that the molding material is compressed to mold a bas molding and a sealing molding is formed in the recession 3. Next, the mold is opened, and a molding material for coating is supplied to a pot 5 for a coating material. Next, a clearance for molding a coating layer is formed between the base molding and the inner surface of the recession 2, the mold is clamped again with the molding for sealing inserted into the recession 3. After that, an injection plunger 13 is actuated to inject/pack a molding material for coating from the pot 5 into a clearance for molding a coating layer.
申请公布号 JPH11129271(A) 申请公布日期 1999.05.18
申请号 JP19970295195 申请日期 1997.10.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 NAKAJO TOSHIJI
分类号 B29C43/18;B29C43/20;B29C43/34;B29L9/00;B29L22/00;(IPC1-7):B29C43/18 主分类号 B29C43/18
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