| 摘要 |
A plating cell for plating a flat substrate employs a sparger to introduce a flow of electrolyte or other plating solution across the surface of the substrate to be plated. A fluid-powered rotary blade or wiper within the cathode chamber has a rotary blade with an edge spaced a small distance, preferably about three-eighths inch, from the substrate, and an annular turbine which rotates under a flow of the electrolytic fluid that is also being fed to the sparger. The rotary wiper is run at a speed between about 35 and 80 rpm and draws the electrolyte away from the substrate. This helps remove hydrogen bubbles that form during electroplating. In addition, a megasonic transducer applies megasonic acoustic energy to the solution, e.g., at 0.2 to 5 MHz.
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