| 摘要 |
A coupling between distributed constant lines which are provided on an individual chip is made so that deterioration in their characteristics may not be caused by an inductance. A first microstrip line 42 and a second microstrip line 44 are provided on an underlayer metal plate 10, separately from each other with a gap domain 60 interposed therebetween. The first microstrip line 42 is composed of a first grounding conductor 12, a first dielectric substrate 14, and a first conductor line 46 which are stacked one after another. The second microstrip line 44 is composed of a second grounding conductor 13, a second dielectric substrate 16, and a second conductor line 48 which are stacked one after another. The first conductor line 46 is provided with a first gap 56 extending in the direction q perpendicular to the arrangement direction p, and the second conductor line 48 is provided with a second gap 58 extending in the direction q perpendicular to the arrangement direction p. When assuming that the wavelength corresponding to the central frequency of a desired frequency band is lambda , the distance between the first gap 56 and the gap domain 60 along the arrangement direction p and the distance between the second gap 58 and the gap domain 60 along the arrangement direction p are, respectively, set at m lambda /2 (where m is an integer).
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