发明名称 |
Hollow package manufacturing method |
摘要 |
A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.
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申请公布号 |
US5904501(A) |
申请公布日期 |
1999.05.18 |
申请号 |
US19970824459 |
申请日期 |
1997.03.26 |
申请人 |
NEC CORPORATION |
发明人 |
OHARA, MASATOSHI;OGIHARA, TAKEO;MURATA, SATOSHI;UCHIDA, KENJI;KUBOTA, TSUTOMU;ICHIKAWA, SEIJI;HIROKAWA, TOMOAKI;KIMURA, TOMOAKI;SATO, TAKU;TANAKA, JUNICHI |
分类号 |
H01L23/02;H01L21/00;H01L23/04;H01L23/10;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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