| 摘要 |
<p>A sealing arrangement (100) is provided for sealing an orifice (110, 325) between an interior and an exterior surface of an electronic module (10, 300). An air-permeable, water-impermeable membrane (120) is disposed in the orifice. A portion of the exterior surface is provided with at least one surface channel (140) which extends between the orifice and a distant point. A protective cover (130) is attached to the exterior surface and arranged to overlie the membrane disposed about the orifice but not to overlie the distant point, thereby providing an air path to the interior surface of the module, via the surface channel and the membrane.</p> |
