发明名称 Ball grid array module
摘要 A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. A Faraday Cage is realized to protect the active element from external HF wave interferences. The lateral sides of the Faraday Cage are constituted by a row of solder balls connected in a zig-zag way to plated through holes along the four edges of the substrate. The top side of the Cage is the metal stiffener of the Cavity Down package electrically connected to the through holes, while the bottom side is represented by the ground plane of the main board properly connected to the solder balls.
申请公布号 EP0872888(A3) 申请公布日期 1999.05.12
申请号 EP19970308907 申请日期 1997.11.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 VENDRAMIN, GIUSEPPE
分类号 H05K9/00;H01L23/12;H01L23/498;H01L23/50;H01L23/552;H01L23/60;H05K1/18 主分类号 H05K9/00
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