Halbleiteranordnung mit einem Halbleiterelement von Flip-Chip-Typ

摘要

UHF semiconductor device including: - a semiconductor element of the "FLIP-CHIP" type, which comprises a semiconductor substrate (1), one face of which, called active face (1a), has at least one integrated circuit (200) and a plurality of metal input-output lands (101a, 102a, 202a, 301a), as well as, on the one hand, a transmission line circuit of the coplanar type (L1, L2, L3, l), the conducting strips and the earth metallisations (M11, M12) of which are arranged on the active face (1a), and, on the other hand, a transmission line circuit of the microstrip type (110, 111, 112, 113), the conducting strips of which are arranged on the opposite face (1b) to the active face, and the earth metallisations (M11, M12) of which consist of those of the active face, - a base card (2), which comprises an insulating substrate one face of which, called front face (2a), has a plurality of input-output metal lands (101c, 102c, 202c, 301c), as well as earth metallisations (M13) traced out in such a way as to be in electrical contact with the earth metallisations of the active face (1a) of the semiconductor element (1) when the latter is fixed onto the base card, - and means of fixing the active face of the semiconductor element onto the front face of the base card, with the corresponding input-output lands in electrical contact, Application : monolithic UHF circuit in telecommunications.