发明名称 Curable resin material, e.g. for printed circuit boards
摘要 A radically polymerizable curable resin (A) obtained by reacting: (a) an epoxy resin containing two or more epoxy groups, with (b) a phenolic compound containing at least one alcoholic hydroxyl (OH) group, and (c) at least one unsaturated monobasic acid. Independent claims are also included for the following: (i) a curable resin (B) obtained by reacting resin (A) with a polybasic anhydride; (ii) a curable resin (C) obtained by reacting resin (A) and/or (B) with a chain extender containing at least two suitable functional groups; and (iii) curable resins containing (A), (B) and/or (C) and a polymerization initiator.
申请公布号 DE19851810(A1) 申请公布日期 1999.05.12
申请号 DE1998151810 申请日期 1998.11.10
申请人 NIPPON SHOKUBAI CO. LTD., OSAKA, JP 发明人 OHTSUKI, NOBUAKI, SUITA, OSAKA, JP;AWAJI, TOSHIO, KAWANISHI, HYOGO, JP
分类号 C08F290/06;C08G59/14;C08G59/16;C08L63/10;G03F7/032;G03F7/038;H01L23/29;(IPC1-7):C08G59/14;C08L63/00 主分类号 C08F290/06
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