发明名称 |
An electronic component device and its manufacturing method |
摘要 |
Simplified structures for connecting electrodes of an electronic component contained in an envelope with lead-out electrodes are disclosed. Through holes are formed on the envelope, and metal foils are attached to the ends of the through holes at the envelope's inner side, with which electrodes of the electronic component are connected. <IMAGE> |
申请公布号 |
EP0665642(B1) |
申请公布日期 |
1999.05.12 |
申请号 |
EP19950101183 |
申请日期 |
1995.01.27 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KONDO, SHUJI |
分类号 |
H03H3/08;H03H9/10;H03H9/25;(IPC1-7):H03H3/08 |
主分类号 |
H03H3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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