| 摘要 |
<p>Disclosed herein is a thermosetting resinous adhesive composition comprising: (a) a thermosetting resin composition comprising phenol, melamine, formaldehyde, and urea, said composition comprising at least 25 weight percent of melamine and at least 10 weight percent of phenol; (b) a curing catalyst; (c) water added in an amount sufficient to impart a suitable viscosity. Also disclosed is a stable copolymer resin precursor composition for use as a precursor to the thermosetting adhesive. Further disclosed are methods of preparing the adhesive composition and precursor. Further disclosed are engineered wood products made in accordance with the present invention.</p> |
