Verfahren zur Befestigung von Bauelementen auf einem Substrat und Bestückungsmaschine hierfür

摘要

The present invention relates to a method for mounting components onto a substrate such as mounting I.C's onto a printed circuit board, wherein the components being attracted by means of attracting nozzles disposed on a head unit of a component mounting machine, having the component investigated as to its attracted state through a component attracted state detecting system. Moreover, the present invention relates to a component mounting apparatus adapted to perform said method. According to the present invention, the detecting system for investigating the attracted state of the component comprises an optical detecting means and a photographing means which are alternatively used in response to the kind of the component to be mounted. A main processor activates the most appropriate detecting device such as the optical or photographing detecting means in response to the type of the component attracted.