| 摘要 |
A multiple integrated circuit intra-package configuration having a centrally mounted integrated circuit die and an additional circuit device mounted in the package periphery. The additional circuit device may provide multiple functions, for example, to protect and enhance the performance of the integrated circuit die. Examples of such functions are electrostatic discharge protection circuits and temperature sensing. The intra-package circuit device avoids problems such as simple and complex process compatibility and additional space requirements of utilizing components external to the package. The multiple circuit intra-package configuration utilizes the small space available in the vicinity of lead posts in integrated circuit packages such as SOIC and TSSOP configurations to mount circuit devices. In one embodiment, a circuit device, for example, a diode, is mounted on a lead post and connected as desired using any of a variety of connectability alternatives such as wire bonding. In another embodiment, the integrated circuit die is attached conventionally to a die pad having a die pad extension disposed between lead posts. A circuit device is mounted on the die pad extension and connected as desired. Additionally, within the same package multiple circuit devices may be present and a large number of interconnectability options and versatile configurations are available. <IMAGE> |
